Our teams work in the following areas:

Characterisation/Reliability – Security:

• CEM, environment, international security regulations and directives, AMDEC, MTBF, etc.

PCB:

• Routing placement/assembly process, plating, etc.

Manufacturing technology:

• Technology supervision, implementation and testing of new technology and assembly procedures on PCBs and electronic components

Micro-electronics:

• • Mixed integrated circuit validation methodology