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Physical component

Our teams work in the following areas:

Characterisation/Reliability – Security:

  • CEM, environment, international security regulations and directives, AMDEC, MTBF, etc.

PCB:

  • Routing placement/assembly process, plating, etc.

Manufacturing technology:

  • Technology supervision, implementation and testing of new technology and assembly procedures on PCBs and electronic components

Micro-electronics:

  • • Mixed integrated circuit validation methodology